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Foxconn WIN-A2

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Foxconn WIN-A2

FCC approval date: 07 March 2011

Interface: SDIO (module)

Form factor tags: module

ID: 02d0:a962

FCC ID: MCLWINA2
Industry Canada ID: 2878D-WINA2

WI1 chip1: Broadcom BCM43362

Probable Linux driver
brcmfmac (SDIO in backports)
(see also passys)

Antenna connector: U.FL

bgn, 1x1:1

has accessible UART

OUI: none specified

For a list of all currently documented Broadcom chipsets with specifications, see Broadcom.



802.11n Wireless Module

  • This device is a wireless module in the Nintendo Wii U.
It is visible in iFixit's teardown of the unit.
  • The full part number of the Broadcom chip is BCM43362KUBG.
BCM43362 SDIO: 0xA962 brcmfmac (3.14+)