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D-Link DWL-900AP+ rev C

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D-Link DWL-900AP+ C

FCC approval date: 14 March 2003

Type: access point

FCC ID: KA2ACX100, O7J-GL2422MP-MT

Power: 5 VDC, 2 A
Connector type: barrel

CPU1: Conexant CX82100
FLA1: 1 MiB
1,048,576 B
8,192 Kib
1,024 KiB
8 Mib
9.765625e-4 GiB
(STMicroelectronics M29W800DB)
RAM1: 8 MiB
8,388,608 B
65,536 Kib
8,192 KiB
64 Mib
0.00781 GiB
(ICSI IC42S16400-7T)

Expansion IFs: none specified

WI1 module: Global Sun GL2422MP-MT
WI1 module IF: Mini PCI
WI1 chip1: Texas Instruments ACX100
WI1 chip2: Maxim MAX2820
WI1 802dot11 protocols: b
WI1 antenna connector: RP-SMA

ETH chip1: Conexant CX82100
ETH chip2: VIA Model?
LAN speed: 10/100
LAN ports: 1

b

802dot11 OUI: none specified

 FCC ID
D-Link DI-614+ rev B1KA2ACX100
O7J-GL2422MP-MT
D-Link DI-614+ rev B2KA2ACX100
D-Link DWL-520+ rev B1KA2ACX100
O7J-GL2422MP-MT
 FCC ID
D-Link DI-614+ rev B1KA2ACX100
O7J-GL2422MP-MT
D-Link DWL-520+ rev B1KA2ACX100
O7J-GL2422MP-MT
Global Sun GL2422MP-MTO7J-GL2422MP-MT
 CPU1 brandWI1 chip1 brandWI1 chip2 brand
D-Link DWL-900AP+ rev A, BSamsungTexas InstrumentsRFMD
D-Link DWL-900AP+ rev CConexantTexas InstrumentsMaxim
For a list of all currently documented Conexant chipsets with specifications, see Conexant.
For a list of all currently documented Texas Instruments chipsets with specifications, see Texas Instruments.


 • Support page

OEM Global Sun GL2422AP-1T1 (GL2422AP-1T1-B10)

see the DWL-900AP+ page on Seattle Wireless
D-link DWL-900AP+ Hardware Overview