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D-Link DWL-2000AP+ rev A1

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D-Link DWL-2000AP + A1

Manuf/OEM/ODM Global Sun GL2454AP -LA0-B10

FCC approval date: 11 August 2003

Type: access point

Power: 5 VDC, 2.5 A
Connector type: barrel

CPU1: Brecis MSP2007
FLA1: 1 MiB
1,048,576 B
8,192 Kib
1,024 KiB
8 Mib
9.765625e-4 GiB
(Macronix 29LV800BTC-90)
RAM1: 8 MiB
8,388,608 B
65,536 Kib
8,192 KiB
64 Mib
0.00781 GiB
(Hynix HY57V643220CT-6)

Expansion IFs: Mini PCI
Mini PCI slots: 1
JTAG: yes, JP1

WI1 module: Global Sun GL2454MP-0T
WI1 module IF: Mini PCI
WI1 chip1: Texas Instruments TNETW1130
WI1 chip2: Radia RC2422B
WI1 802dot11 protocols: bg
WI1 antenna connector: none

ETH chip1: Brecis MSP2007
ETH chip2: Kendin KS8721B
LAN speed: 100M
LAN ports: 1

bg

802dot11 OUI: 00:0D:88 (7 E, 22 W, 2003)
Ethernet OUI: 00:0D:88 (7 E, 22 W, 2003)

 FCC ID
D-Link DI-624+KA2T1130
O7J-GL2454MP-0T
D-Link DI-624+ rev A1KA2T1130
D-Link DI-624+ rev B2KA2T1130
Global Sun GL2454MP-0TO7J-GL2454MP-0T
KA2T1130
 FCC ID
D-Link DI-624+KA2T1130
O7J-GL2454MP-0T
Global Sun GL2454MP-0TO7J-GL2454MP-0T
KA2T1130
Global Sun GL2454VP-0TO7J-GL2454MP-0T
USRobotics USR5416O7J-GL2454MP-0T
USRobotics USR5450O7J-GL2454MP-0T
USRobotics USR8054O7J-GL2454MP-0T
For a list of all currently documented Brecis SoC's with specifications, see Brecis.
For a list of all currently documented Texas Instruments chipsets with specifications, see Texas Instruments.


AirPlus Xtreme G+ 2.4GHz (802.11g) Wireless Access Point

 • Support page

"GL2454AP-LA0-B10" and "VER:T3.0" is silkscreened on the board in the FCC photos.

The device has an Altera EPM3032A PLD on-board.

Global Sun GL2454MP-0T (T3.0) VLYNQ wireless module?

Texas Instruments TNETW1130GVF
Radia RC2422B

CPU: Brecis MSP2007-CA-A2 @166MHz