See 'WikiDevi' @ the Internet Archive (MW XML, Files, Images)
upgraded MW to 1.30 - maybe things are slightly less broken

D-Link DI-714P+ rev B1

From WikiDevi
Jump to: navigation, search

D-Link DI-714+ B1


Country of manuf.: Taiwan

Type: wireless router, print server


Power: 5 VDC, ? A
Connector type: barrel
Conn. measurements: 5.5 mm (OD), 2.2 mm (ID), 10 mm (LEN)

CPU1: Conexant CX82110-51
FLA1: 1 MiB
1,048,576 B
8,192 Kib
1,024 KiB
8 Mib
9.765625e-4 GiB
(AMD Am29LV800BB-90EC)
RAM1: 8 MiB
8,388,608 B
65,536 Kib
8,192 KiB
64 Mib
0.00781 GiB
(GLT GLT5640L16-6TC)

Expansion IFs: Parallel

WI1 module: National Datacomm NWH1021
WI1 module IF: unknown
WI1 chip1: Texas Instruments ACX100
WI1 chip2: Ralink Model?
WI1 802dot11 protocols: bg
WI1 antenna connector: RP-SMA

ETH chip1: Conexant CX82110-51
Switch: Kendin KS8995X
LAN speed: 100M
LAN ports: 4
WAN speed: 100M
WAN ports: 1


Flags: schematics

Default SSID: default (97 addl. devices)
Default IP address:
the IP is used by 735 additional devices
of which 209 are D-Link devices
Default login user: admin
Default login password: blank
admin:blank credentials used by 316 additional devices
of which 180 are D-Link devices

802dot11 OUI: none specified

For a list of all currently documented Conexant chipsets with specifications, see Conexant.
For a list of all currently documented Texas Instruments chipsets with specifications, see Texas Instruments.

Enhanced 2.4GHz (802.11b) Wireless Router plus Print Server
 • Support page

"103408600Y1" and "WPA400AM-Y1" is silkscreened on the mainboard.

It is possible these units may have differing wireless modules (which do not appear to be standard PCMCIA). This particular one uses a National Datacomm NWH1021. The FCC photos depict the device with an RFMD based DBTel card, however, the FCC photos depict a different main board (probably for the A1 revision).

The OUI of the MAC on the wireless module label is 00:80:C6 (National Datacomm). The OUI on the label affixed to the router is 00:0D:88 (D-Link).
The RP-SMA antenna leads on the case exterior are soldered directly to the wireless module.