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Compex HK01

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Compex HK01 (IPQ8074)
Availability: now

(Est.) release date: July 2018
Country of manuf.: China
Series: AX6000

Type: wireless embedded board

FCC ID: none available

Power: 12 VDC, 5 A
Connector type: barrel

CPU1: Qualcomm IPQ8074 (2 GHz, 4 cores)
FLA1: 256 MiB
268,435,456 B
2,097,152 Kib
262,144 KiB
2,048 Mib
0.25 GiB
(Micron MT29F2G16ABBEAH4:E)
FLA2: 32 MiB
33,554,432 B
262,144 Kib
32,768 KiB
256 Mib
0.0313 GiB
(Macronix MX25L25635F)
RAM1: 1 GiB
1,024 MiB
1,073,741,824 B
8,388,608 Kib
1,048,576 KiB
8,192 Mib
(Micron MT41K256M16TW-107 × 2)

Expansion IFs: Mini PCIe, USB 3.0, SFP+
Mini PCIe slots: 2
USB ports: 2
SFP ports: 1
JTAG: yes, 20-pin header
Serial: yes, 12-pin header

WI1 chip1: Qualcomm QCN5054
WI1 chip2: Qualcomm QCN5054
WI1 802dot11 protocols: an+ac+ax
WI1 MIMO config: 8x8:8
WI1 antenna connector: U.FL
WI2 chip1: Qualcomm QCN5024
WI2 802dot11 protocols: bgn+ax
WI2 MIMO config: 4x4:4
WI2 antenna connector: U.FL

ETH chip1: Qualcomm IPQ8074
ETH chip2: Aquantia AQR107
Switch: Qualcomm Atheros QCA8075
LAN speed: 1G
LAN ports: 5
WAN speed: 10G
WAN ports: 1


Flags: DBDC, DFS, SFP+, SD Card slot

802dot11 OUI: none specified

For a list of all currently documented Qualcomm chipsets with specifications, see Qualcomm.

1148 Mbps - 4SS 2.4GHz 802.11ax (40MHz chan.)
4800 Mbps - 8SS 5GHz 802.11ax (80MHz chan.) = AX6000 class

8×8 11ax MU-MIMO Dual Band Dual Concurrent Embedded Board

Product page
  • 8×8 11ax MU-MIMO Dual Band Dual Concurrent Embedded Board
Qualcomm IPQ8074 802.11ax Reference Design
Flash: 32MB (NOR)/256MB (QPIC NAND)/8GB (eMMC NAND)
RAM: 2x 4Gb (1GB - 2x Micron RAM DDR3L System Memory)
  • LAN: 1x 10Gbps Ethernet port, WAN/LAN: 5x GbE ports
  • 2x Mini PCIe slots, 2x USB 3.0 ports, 1x SFP+ (10GbE) port
  • WLAN: Transmit power (per chain): 23dBm (2.4GHz)/20dBm (5GHz)
4×4 On-board 2.4GHz radio, up to 1147Mbps physical data rate
8×8 On-board 5GHz radio, up to 4.8Gbps physical data rate
Supports Dynamic Frequency Selection (DFS)


PCB image on Compex