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BEC Technologies MX-230 M1

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BEC Technologies MX-230 M1

FCC approval date: 09 August 2018
Country of manuf.: Taiwan

Type: LTE router, 4G LTE router

FCC ID: QI3BIL-MX230M1, XMR201707BG96, XMR
Industry Canada ID: 10224A-201709BG96

Power: 9 VDC, 1.34 A
Power over Ethernet (PoE) tag: non-standard (otherwise unspecified)

CPU1: MediaTek MT7525
CPU2: Qualcomm MDM9206
FLA1: 32 MiB
33,554,432 B
262,144 Kib
32,768 KiB
256 Mib
0.0313 GiB
(Macronix MX25L25635FMI-10G)
FLA2: 128 MiB
134,217,728 B
1,048,576 Kib
131,072 KiB
1,024 Mib
0.125 GiB
(Winbond W71NW10GE3FW)
RAM1: 64 MiB
67,108,864 B
524,288 Kib
65,536 KiB
512 Mib
0.0625 GiB
(Winbond W9751G6KB25I)
RAM2: 64 MiB
67,108,864 B
524,288 Kib
65,536 KiB
512 Mib
0.0625 GiB
(Winbond W71NW10GE3FW)

Expansion IFs: Mini PCIe
Mini PCIe slots: 1

WI1 module: Quectel BG96
WI1 module IF: Mini PCIe
WI1 chip1: Qualcomm MDM9206
WI1 802dot11 protocols: LTE
WI1 antenna connector: none

ETH chip1: MediaTek MT7525
LAN speed: 1G
LAN ports: 1
WAN speed: 1G
WAN ports: 1


Flags: LTE, Dual WAN, TR-069, mini SIM Card slot

Default IP address:
the IP is used by 153 additional devices
of which 2 are BEC Technologies devices
Default login user: admin
Default login password: blank
admin:blank credentials used by 316 additional devices
of which 0 are BEC Technologies devices

802dot11 OUI: none specified
Ethernet OUI: 00:04:ED (3 E, 3 W, 2015)

For a list of all currently documented MediaTek chipsets with specifications, see MediaTek.
For a list of all currently documented Qualcomm chipsets with specifications, see Qualcomm.

4G/LTE Industrial M2M Router

  • Quectel BG96 LTE Cat. M1/NB1 & EGPRS Module
is included with the product (CPU2, FLA2, RAM2)
  • Winbond W71NW10GE3FW - Combo Memory Chip
Flash: 1Gb (NAND) + RAM: 512Mb (LPDDR2)